Are you having trouble bonding with different materials? One-component flexible epoxy resin adhesive.
Exhibits rubber-like flexibility and low elasticity! Effective for bonding heterogeneous materials with a large difference in thermal expansion coefficients. "Plain Set - Flexible Type"
★Are you facing any of these issues? 〇 The adhesive area is small, and the adhesive part peels off or breaks during drop impact tests. 〇 You want to significantly reduce vibrations and noise from motors, etc. 〇 Different materials such as engineering plastics and metals do not bond well together. The "Plain Set Flexible Type" is a low-temperature curing adhesive that provides flexible bonding with high impact resistance and stress relaxation effects. Generally, epoxy resins have high strength and elasticity, but our unique formulation technology achieves a composition with low elasticity and flexibility. It solves problems such as "the adhesive part peels off or breaks" and "the vibrations and noise from motors are loud." 【Features】 ■ Cures at a low temperature of 80°C ■ Becomes a rubber-like elastomer after curing, providing effective flexibility for stress relaxation and shock/vibration absorption ■ As a low-elasticity material, it has high peel strength and is effective for bonding dissimilar materials with a large difference in linear expansion coefficients. *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our company website at the URL below.
basic information
【For these concerns】 ■ The adhesive area is small, and the adhesive part peels off or breaks due to impact from falls. ■ I want to suppress vibrations and noise from motors and other sources. ■ I want to bond dissimilar materials such as engineering plastics and metals. *For more details, please refer to the PDF document or feel free to contact us. We also provide evaluation samples.
Price range
Delivery Time
Model number/Brand name
PLENSET Flexible Type
Applications/Examples of results
【Applications】 ■ Adhesion to components subjected to shock and vibration ■ Adhesion to dissimilar materials and difficult-to-bond materials (engineering plastics such as LCP, PA9T, and metals like gold and nickel) ■ Adhesion and bonding to flexible components such as flexible circuit boards and displays that require flexibility ■ Adhesion and sealing of thin film components without warping or deformation *For more details, please refer to the PDF document or feel free to contact us.
