[Exhibition Participation] No need for reflow or flux cleaning! Reduction of processes and use of materials with low heat resistance is possible. "Plain Set - Conductive Type"

★Are you facing any of these issues? 〇 Unable to apply solder due to the inclusion of heat-sensitive components 〇 Want to mount and join components on flexible substrates 〇 Looking to improve connection reliability between terminals (gold, copper, nickel, tin, etc.) The "Plain Set Conductive Type" is a conductive adhesive that balances conductivity and adhesion based on a low-temperature curing of 80°C. It excels in adhesion and crack resistance, and because it can cure at low temperatures, it can serve as an alternative to solder for electronic components that cannot withstand reflow or high curing temperatures due to heat resistance issues. By not using solder, it eliminates the need for flux cleaning, contributing to a reduction in processes. 【Features】 ■ Cures at a low temperature of 80°C ■ Can replace solder ■ Suppresses the increase in contact resistance with nickel and tin 【Exhibition Information】 Exhibition Name: High-Function Materials Week Adhesive Bonding EXPO Date: October 29 (Tuesday) to 31 (Thursday), 2024, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Booth Number: 15-27 *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our website at the URL below.

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