Substrate "Copper Base Wiring Board with Posts"
Direct heat conduction to the base material!
The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.
basic information
<Specifications> (1) Single-layer product ■ Pattern copper foil, foil thickness: 35/70/(105) μm ■ Insulation layer: thickness: 0.08mm Thermal conductivity: 0.3–0.4 W/m·K ■ Base copper 1: thickness: 0.2, 0.3, 0.5mm oxygen-free copper Thermal conductivity: 391 W/m·K ■ Base copper 2: thickness: 1.0, 2.0, 3.0mm tough pitch copper Thermal conductivity: 381 W/m·K * The thickness of the base copper includes the height of the post. (2) Double-layer product ■ Pattern copper foil, foil thickness: 35/70/(105) μm ■ Glass epoxy: thickness: 0.2mm Thermal conductivity: 0.3–0.4 W/m·K ■ Insulation layer: thickness: 0.08mm Thermal conductivity: 0.3–0.4 W/m·K ■ Base copper: thickness: 1.0, 2.0, 3.0mm tough pitch copper Thermal conductivity: 381 W/m·K * The thickness of the base copper includes the height of the post. * For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
