AMB substrate
High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.
The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) Aluminum nitride (AlN) Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Application】 ■ Power Devices *For more details, please refer to the PDF document or feel free to contact us.
