DPC substrate
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Plating Method】 <Comparison with Other Methods> ■Conductor Metals: Cu, Ni, Pd, Au, Sn Pb, Cr, Ag… ■Wiring Formation Method: Electroless Plating Electrolytic Plating ■Fine Line Resolution: Sharp ■Conductor Thickness: Thick application possible High degree of freedom ■Pattern Pitch: Line width / Spacing ■Through Holes: Possible High reliability, low resistance, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
