Design and manufacturing of high-frequency substrates capable of heat management.
For applications requiring heat dissipation measures and heat resistance. Compatible with various materials such as copper and ceramics.
Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity → Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity → DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) → Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Copper Base Compatible Fluorine-based Substrate Specifications Example】 <Single Layer> - Pattern Copper Foil Foil Thickness: 35, 70, (105) μm - Base Copper Thickness: 0.2, 0.3, 0.5, 1, 2, 3 mm Thermal Conductivity: 391 W/m·K (Oxygen-free Copper), 381 W/m·K (Tough Pitch Copper) <Double Layer, Four Layer> - Pattern Copper Foil Foil Thickness: 35, 70, (105) μm - Insulation Layer Thickness: 0.08 to 0.2 mm Thermal Conductivity: 0.3 to 0.4 W/m·K - Base Copper Thickness: 0.2, 0.3, 0.5, 1, 2, 3 mm Thermal Conductivity: 391 W/m·K (Oxygen-free Copper), 381 W/m·K (Tough Pitch Copper) *For more details, please refer to the materials. Feel free to contact us with any inquiries.
Price range
Delivery Time
Applications/Examples of results
*For more details, please refer to the materials. Feel free to contact us as well.*
