Thick copper base, AMB substrate printed circuit board for power modules.
Leave it to us for circuit boards for power modules! We manufacture thick copper base wiring boards and boards that bond thick copper to ceramics using the AMB method.
We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications of AMB Substrate】 ■Base Material ・Silicon Nitride: (Si3N4) ・Aluminum Nitride: (AlN) ■Conductor Thickness: 200 to 1000μm *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
