Optris PI640i MO2X infrared thermal imaging camera
High-resolution infrared thermal imaging camera Optris PI640i MO2X for micro-area temperature measurement of substrates and electronic components, supporting 8μm IFOV.
The Optris PI 640i MO2X is an infrared thermal imaging camera that boasts a high resolution of 640×480 pixels and a spatial resolution (IFOV) of 8μm. Equipped with a newly developed 2x microscope lens, it enables accurate temperature distribution measurement of small targets such as electronic components and printed circuit boards. The temperature measurement range is from -20 to 900°C (with sub-range settings available), and it supports high-speed process monitoring with a high frame rate of 32Hz (up to 125Hz). It features manual focus, interchangeable optics, a USB 2.0 interface, a robust IP67 design, and comes standard with the free PIX Connect analysis software. It achieves high-precision infrared temperature measurement for a wide range of applications, from research and development to manufacturing sites.
basic information
Detection element: FPA (uncooled), pixel pitch 17μm Optical resolution: 640×480 pixels Microscope lens (MO2X): Field of view 5.4×4.0mm, IFOV 8μm, working distance 15mm Temperature measurement range: -20 to 900℃ (sub-range setting available, MO2X recommended for -20 to 500℃) Thermal sensitivity (NETD): 80mK Measurement accuracy: ±2℃ or ±2% (whichever is larger) Frame rate: 32Hz (full pixel), 125Hz (sub-frame) Interface: USB2.0 (GigE conversion available) Protection rating: IP67 Dimensions & weight: Approximately 52×59×139mm, approximately 340g (MO2X configuration) Accessories: Microscope stand, base with ESD pad, PIX Connect software
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Applications/Examples of results
The Optris PI 640i MO2X is widely used for thermal design and failure analysis of electronic components and printed circuit boards, evaluation of heat distribution in semiconductor devices, and local heat monitoring of power ICs and processors. With a spatial resolution of 8μm and high-precision temperature measurement, it is effective for detecting abnormal heat generation in fine chips, solder joints, and BGA packages, managing temperatures in rework processes, and analyzing thermal behavior during pulse operation of LEDs and laser diodes. Furthermore, it has a proven track record in various fields, including temperature monitoring of motors and drivers in industrial robots, thermal evaluation of new materials and structural devices in research and development, and 24-hour automatic temperature monitoring systems. It is also used for temperature control of high-temperature metal surfaces and fire prevention in waste disposal sites.
