Substrate warping detection mechanism for partial soldering equipment
Even if warping occurs in the substrate, soldering can be done by offsetting the amount of warping.
- Measure the distance to any location on the substrate using a laser and perform automatic correction of the Z-axis. - Effective for warped substrates such as those after reflow, cracked substrates, and large-sized substrates. - In partial soldering, the height of the jet from the nozzle tip is very important, making it an effective mechanism. #Local Soldering #Partial Soldering
basic information
The number of substrate warpage inspection points and the positions of the inspection points can be set arbitrarily. The measurement position is determined simply by the program camera. Inline type: Synchrodex, Fusion Batch type: JadeMk2, JadePro, Handex can be supported as options.
Price range
Delivery Time
Applications/Examples of results
Industrial machinery, robots, consumer electrical appliances, industrial electrical equipment, electronic components and semiconductors, optical equipment, automotive and transportation equipment, medical devices, manufacturing and processing contracts, other manufacturing, government agencies, service industry.
