Cross-sectional analysis of electronic circuit boards
Introduction to methods for checking defects in solder joints, such as the preparation of cross-sectional observation samples and SEM observation of cross-sectional samples!
We can create cross-sectional observation samples of solder joints on electronic substrates and visually confirm the soldering conditions and the elemental distribution inside the solder joints through surface analysis to check for segregation of soldering constituent elements. This allows us to provide data for your evaluation to ensure that the soldering is done correctly. As part of defect investigation, we can confirm the adhesion conditions of the solder and the presence of voids from cross-sections, as well as any bias in the components within the solder. Please feel free to contact us when you need our services. 【Features】 ■ Ability to confirm the adhesion conditions of solder and voids from cross-sections as part of defect investigation ■ Ability to confirm bias in the components within the solder *For more details, please download the PDF or feel free to contact us.
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