CVD diamond laser microprocessing machine
Over 1,000 units introduced. Achieving high-precision cutting, shape cutting, slicing, and marking. Sample processing consultations are currently being accepted.
The "DCS Series" is a laser fine processing machine equipped with wavelengths, pulse widths, and output energy that can precisely cut, shape, slice, and mark CVD diamonds. It is utilized in countries around the world, with over 1,000 units installed. It is used in processes such as tool edge processing and the precise polishing of semiconductor wafers. 【Examples of Applications】 ■ Tool edge processing ■ 4P diamond three-dimensional shape processing ■ Internal marking ■ Polishing of diamond wafers *For more details, please refer to the materials available for download in the catalog. We are also accepting inquiries for sample processing. Feel free to contact us.
basic information
【Lineup】 DCS-Lite: Output... 15W to 20W, with cutting head DCS-7: Output... 15W to 20W, with cutting head or galvanometer scanner DCS-PRO: Output... 35W, compatible with picosecond laser, with galvanometer scanner *For more details, please refer to the materials. Feel free to contact us as well.
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Model number/Brand name
DCS Series
Applications/Examples of results
*For more details, please refer to the materials. Feel free to contact us as well.*
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Our company handles "industrial laser oscillators" with a proven track record in 24-hour operational production lines. We offer a lineup of LD-pumped solid lasers with nanosecond pulses ranging from 266nm to 1064nm, as well as various picosecond and femtosecond pulse lasers. Additionally, we provide "laser micro-processing machines" equipped with high-precision motion control, such as medical stent processing devices, and "laser marking machines" that can accommodate LD-pumped solid lasers of various wavelengths on a versatile platform. Please feel free to contact us if you have any inquiries.