Laser processing machine for film and resin substrates <Sample processing currently accepting>

Achieving high-precision processing with femtosecond and high-output nanosecond lasers. Improving yield in semiconductor and GPU manufacturing.

We offer laser processing machines for films and resin substrates equipped with laser oscillators that cover a wide range of pulse widths and wavelengths, from nanoseconds to picoseconds and femtoseconds. Our unique trepanning head allows for high aspect ratio drilling at 1:50, and we can accommodate various substrate and film processing needs, including cutting, marking, and thin film removal. Based on the results of sample processing, we will provide proposals considering your budget and target takt time. 【Features】 ■ Improves productivity and yield with precision and high-speed cutting for FPCs and PCBs used in semiconductor mounting. ■ Capable of supporting dual head configurations and automatic transport and discharge functions. ■ Rapid maintenance and support system unique to our Japanese corporation. *For more details, please view the materials by clicking the "Download Catalog" button. For sample processing inquiries, feel free to contact us through the "Contact Us" section.

basic information

We respond to such needs in semiconductor device and electronic substrate manufacturing: ◎ I want to sharply cut ultra-small and ultra-thin substrates. ◎ I want to minimize thermal effects on copper foil, such as peeling. ◎ I want to reduce material damage and distortion caused by processing. ◎ I want to process without cracks or chipping. ◎ I want to accurately cut thin wafers, shapes, and wiring. 【Installed Laser Oscillators】 ◎ Femtosecond UV Laser ◎ Nanosecond 266nm Laser ◎ High-Power Nano and Picosecond Lasers ◎ Compact Picosecond Laser for Marking Please feel free to consult us about installation and operational support for overseas factories.