High-Precision Wafer Crack Inspection Device "Super Macro SM75"
Inspection in one shot for 300mm wafers in 1 second.
The high-precision wafer crack inspection device "Super Macro SM75" can inspect 300mm wafers in less than one second with a full-field one-shot, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of small-field optical systems and can be applied to internal void inspections by using infrared light as an optional light source. In recent years, wafers have been becoming thinner, but this high-precision wafer crack inspection device can quickly inspect the entire wafer for chip cracks caused by the unevenness of BG processing, polishing marks, and stress. For more details, please download the catalog.
basic information
【Features】 ○ Automatic inspection available ○ Standalone type also available ○ Manual inspection possible ○ Customizable slice level settings ○ Soma mark removal function ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
【Applications】 ○ Patterned wafer crack inspection ○ Bare wafer crack inspection ○ Wafer edge damage inspection ○ Evaluation of BG polishing marks ○ Evaluation of slurry ○ Residual stress in glass substrates ○ Evaluation of stress relief ○ Tension inspection of BG tape ○ Distortion and scratch inspection of compound wafers ○ Pulsation inspection of lenses and optical components ○ Stress distortion of various works due to pressure ● For more details, please contact us or download the catalog.
