Variety Teaching "Wire Bonding Inspection Device"
Optimal for specifying inspection positions and testing measurements with set parameters. Easy to operate.
The "Wire Bonding Inspection Device" for model teaching displays images of ideal samples that have been captured, allowing for the specification of inspection positions and test measurements to be conducted with simple mouse operations using the set parameters. Results such as wire trajectories are visually displayed, making verification easy. For more details, please download the catalog.
basic information
【Features】 ○ Wire Inspection → Tracks each wire individually to inspect for abnormalities in wire shape. ○ Au Wire Bond Ball Diameter Inspection → Inspects bond shape (aspect ratio) and can accurately check for overflow from the pad. ○ IC Scratch and Foreign Object Inspection (Optional) → Compares with inspection images to check the area and shape of any discrepancies. ○ 3D Stereo Imaging → Captures images of the workpiece using two or four cameras set at a fixed angle. ○ Wire Height Inspection → Tracks the wire using images obtained from 3D stereo imaging and compares data between opposing cameras. ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
For more details, please refer to the catalog or contact us.
