Inspection device "Wafer Edge Appearance Inspection Machine"
Inspection of defects such as scratches, foreign objects, and cracks. Achieving detailed image inspection of edges.
The inspection device "Wafer Edge Appearance Inspection Machine" simultaneously inspects defects such as scratches, foreign objects, and cracks on the edge and three surfaces (top and bottom) of the wafer through high-speed optical image inspection. (The inspection time for an 8” wafer is 6 seconds, making it very fast.) The wafer is adhered to the back side, and its shape is recognized by the camera to detect outer diameter eccentricity and the position/amount of the orifice, which controls the inspection machine. The newly developed triple optical system and integrated lighting have enabled detailed image inspection of the edge. External PIO control is also possible, allowing it to be integrated into automated systems. It can accommodate wafer sizes from 4 inches to 8 inches. For more details, please download the catalog.
basic information
【Features】 ○ Inspects three edges simultaneously with a single camera ○ Adjustable wafer thickness from 0.2 mm to 1.5 mm ○ Achieves optimal shadow-free illumination with a triple optical system and integrated lighting ○ Capable of exterior inspection including the orifice area ○ Image measurement resolution of 10 μm ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
For more details, please refer to the catalog or contact us.
