Super Macro SM75
Inspection possible in 1 shot per second with 300mm wafers. Adopted for fully automated inspection lines.
The Super Macro SM75 can inspect 300mm wafers in one shot in just one second, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of optical systems for small fields of view, and by using infrared as an optional light source, it can also be applied to internal void inspections. For more details, please contact us or download the catalog.
basic information
**Main Features** ○ Short inspection time → Capable of inspecting 300mm wafers in one shot in 1 second → Due to the short inspection time, it is also adopted in fully automated inspection lines ○ Available in a compact optical system with a small field of view, and can be applied to internal void inspections by using infrared as an optional light source ○ Recently, wafers have been getting thinner, but this high-precision wafer crack inspection device inspects the entire wafer field at high speed, addressing issues such as non-uniformity from BG processing, polishing marks, and chip cracks caused by stress ○ In addition to automatic inspection, standalone types are also available for manual inspection ○ Capable of inspections tailored to needs by setting any slice level ○ Depending on the application, it also has a function for removing surface marks, automatically extracting defect components excluding polishing marks ○ Unlike general photography, the light applied to the subject is "parallel light" → Converts the delicate unevenness of the surface into shades of the image for automatic inspection ● For more details, please contact us or download the catalog.
Price information
For more details, please contact us.
Delivery Time
Model number/Brand name
SM75
Applications/Examples of results
For more details, please contact us.
