Ultra-high-speed wire bond 3D appearance inspection device
It is a short-time inspection, 3D measurement, high-precision, customizable appearance inspection device.
This device is an image processing system that performs visual inspection of wires and bonding on a substrate at ultra-high speed (1 field per second). It consists of two stations: a three-dimensional image processing unit that measures the height of the wires and a high-resolution two-dimensional image processing unit that measures wire bending and ball placement. The two-dimensional and three-dimensional image processing units operate alternately, and there are two image processing PCs. All cameras are fixed, and the mechanical device moves the substrate. ■ Example of Device Configuration (Two-Dimensional Image Processing Unit) - 5-megapixel CCD camera - Lens with magnification of 1.5x - Blue LED dome coaxial illumination - LED power supply 3HC (Three-Dimensional Processing Unit) - 1.3-megapixel CCD camera - CCTV lens f=50mm - Red LED dome illumination - Image processing PC and camera capture board
basic information
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Price range
Delivery Time
Applications/Examples of results
Appearance inspection of wire bonding on substrates.
