Special diamond grinding stone with a honeycomb structure
Are you wasting whetstone with dressing? High-efficiency grinding of cutting-edge electronic materials.
The diamond section has a higher bonding strength compared to the core section. When the workpiece is pressed against it, the core section wears out faster. The diamond section, which is approximately 10 microns higher (depending on the diamond grain size), will always be in contact with the workpiece. The size of the core section and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution of the diamond against the workpiece, thus maximizing the power of the grinding wheel. <Features> - Ideal cutting performance and grinding wheel lifespan with the size and thickness of the honeycomb! - The abrasive grains in the core section enhance processing efficiency due to the action of free abrasive grains. - Maximizes non-dress and dress intervals. - Load distribution can be controlled through diamond patterning.
basic information
Please refer to the catalog for details.
Price range
Delivery Time
Applications/Examples of results
Grinding processing of electronic component materials, etc.
