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EVA-based hot melt adhesive for packaging 'LR620' *Low temperature application type

Reduce line troubles and contribute to total cost reduction. Stable adhesion to various substrates such as cardboard.

"LR620" is a low-temperature application type EVA-based hot melt adhesive suitable for packaging purposes. It has excellent adhesion and demonstrates stable bonding strength on various substrates such as cardboard. Its thermal stability is also good, making it resistant to degradation of the main components, which reduces the frequency of line stoppages caused by the generation of carbon and residues. Compared to general packaging grades, it has less stringing, contributing to a reduction in the frequency of line cleaning. 【Features】 ■ Reduces bonding failures with excellent adhesion ■ Strong adhesion even on difficult-to-bond water-repellent liner paper ■ Reduces the frequency of line stoppages due to nozzle clogging *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Related Link - https://www.asahimelt.com/FS-APL/FS-Form/form.cgi?…

basic information

【Representative Material Properties】 Main Component: EVA Heat Resistance: 60℃ (based on in-house testing) Set Time: 1 second Stringing Amount: 25–50mg (based on in-house testing) In addition to 'LR620', we also offer a lineup for heat resistance, hot filling/high heat resistance, difficult-to-bond substrates, anti-slip applications, straw attachment, and cushioning material adhesion. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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For more details, please refer to the materials. Feel free to contact us as well.

Introduction materials for packaging EVA-based hot melt adhesive "LR620".

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Since its establishment in 1952, Asahi Chemical Industry has been a specialized manufacturer of adhesives for nearly half a century. In particular, in the field of hot melt adhesives, which we began developing and manufacturing in 1960, we not only offer a wide range of products but also respond to various challenges faced by users based on the extensive technical know-how we have cultivated over many years.