Power Module Material Evaluation System ASU/PM-Lifetime
We evaluate the reliability of next-generation power module implementation materials after installation through statistical simulation, supporting the design of optimal material parameters.
ASU/PM-Lifetime is a system designed to efficiently evaluate the reliability of power module implementations, providing strong support for material development and module design. This system allows for the evaluation of the lifespan of bonding materials and wire bonding during temperature cycle/power cycle tests, as well as the impact of factors such as module dimensions and material properties on implementation reliability. With a user interface specifically tailored for power module evaluation, it is user-friendly and enables power module assessments without requiring specialized knowledge in simulation. 【Features】 ■ Lifespan evaluation of power modules By inputting the individual characteristics of the implementation materials, the lifespan in the implementation state of the power module can be predicted. ■ Goal setting in implementation material design A statistical evaluation of numerous material parameter factors supports the goal setting for material design. ■ Utilization in industry-academia collaboration projects The results of the industry-academia collaboration project (KAMOME A-PJ) for implementation material development have been incorporated into the software as know-how.
basic information
【Evaluation Target Tests】 - Temperature Cycle Test - Power Cycle Test (Constant Tj Conditions) 【Setting Items】 - Power Module Structural Shape - Material Properties of Power Module Constituent Materials - Reliability Test Conditions (Temperature Cycle Test, Power Cycle Test)
Price range
P4
Delivery Time
OTHER
Applications/Examples of results
【Applicable Fields】 ■ Development of Power Module Packaging Materials ◇ Die Attach Materials ◇ Encapsulation Resins ◇ Thermal Conductive Resin Sheets ◇ Metallized Substrates, etc. ■ Reliability Design of Power Modules ◇ Thickness of Die Attach ◇ Wire Bonding, Bus Bars ◇ Chip Size, Arrangement, etc.
