先端力学シミュレーション研究所 Official site

ASU/V-Struct Release Analysis Edition

Predicting and solving product behavior during demolding in resin molding! By identifying the causes of demolding defects and taking preventive measures, we reduce design changes and renovation costs.

This is the "ASU/V-Struct Release Analysis Edition," customized specifically for release analysis during resin injection molding. It is software designed to identify the causes of release defects during injection molding and to implement countermeasures in advance, thereby improving the quality of molded products and reducing the costs associated with mold design changes and modifications. - It enables the prediction of sticking and cavity capture in advance, identifying areas that will be captured by the cavity based on displacement distribution and node force distribution. - It allows for the prediction of whitening and warping due to protrusion arrangement balance, identifying areas of deformation in molded products based on the evaluation of protrusion loads for each protrusion. - It can accommodate inclined cores (upward and downward) and diagonal movement of slide units. - It enables high-precision predictions that inherit the temperature distribution during injection molding (using ASU/MOLD).

basic information

The ASU/V-Struct, which serves as the basis for the Deformation Analysis Edition, is a high-performance thermal-elasto-plastic structural analysis program developed based on V-Struct through the VCAD system research program at the RIKEN Institute. It features a thermal stress-thermal conduction coupled analysis solver that takes into account contact between deformable bodies, contact heat transfer, and pressure application to processed materials. This allows for the simulation of deformation and residual stress in molded products due to heat in processes such as hot pressing, casting solidification, and resin injection molding cooling, where temperature changes need to be considered. It is also applicable to other scenarios such as mold deflection, clamping, vacuum forming, and adhesion analysis. Applicability: To address various challenges in manufacturing processes, we have generously incorporated our CAE element technologies, including contact analysis (for rigid and deformable bodies), heat transfer, contact heat transfer, and surface pressure boundaries! Usability: A dedicated pre-post GUI is provided. Even those unfamiliar with analysis can use it easily without resistance. It includes a built-in mesher, allowing analysis to start directly from design CAD data.

Price range

Delivery Time

Applications/Examples of results

[Applicable Fields] ■Automobiles ■Aircraft ■Home Appliances ■Office Automation ■Medical Devices ■Low Voltage ■Railways ■Shipbuilding ■Optics  etc.

Related Videos

ASU/V-Struct Release Analysis Edition

PRODUCT

Recommended products

Distributors