PARQIT UV Curing Temporary Adhesive
No need for labor-intensive processes, solvents, or removal of residual adhesives! A reusable and SDGs-friendly UV-curable temporary adhesive!
The conventional representative temporary adhesives involve heating and dissolving low melting point hot melt resins, such as wax or rosin, to bond them to the substrate, followed by processing after cooling. During peeling, the resin is re-melted by heating and removed, while the resin remaining on the substrate is cleaned using washing solvents such as warm water or alkaline solutions. Another common method involves using a cleaning solvent to dissolve and peel off temporary adhesives that have been cured by UV or heat. The new type developed by our company is a temporary adhesive that, after bonding the substrate through UV curing, incorporates a thermal history of approximately 200°C for 1 to 10 minutes, allowing for a decrease in adhesive strength at room temperature and enabling peeling. Unlike thermoplastic resins, this adhesive's strength decreases due to thermal history, allowing it to withstand heat environments of around 120°C for 1 hour or 160°C for about 10 minutes. *For more details, please download the catalog or contact us.*
basic information
It is possible to peel off the substrate after returning it to room temperature! By heating the cured adhesive layer and returning the substrate to room temperature during heating, changes occur at the adhesive interface (peeling phenomenon), causing a rapid decrease in adhesive strength. In the case of adhesion between glass substrates, both substrates will peel off from the interface, allowing the resin layer to peel off cleanly in a film-like manner. Depending on the condition of the substrate, a cleaning process may not be necessary. *For more details, please download the catalog or contact us.*
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