Heat-dissipating silicone adhesive
Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation.
Features and Benefits • Thermal conductivity • Soft, compressible • Self-adhesive • Non-flowable and thermosetting • No curing by-products • Addition curing with platinum catalyst
basic information
Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation. It adheres to the surfaces of organic resins, metals, and ceramics without generating by-products during the curing reaction. The thin layer of silicone formed enhances thermal conduction from the device to the heat sink.
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Model number/Brand name
PP2-TC01
Applications/Examples of results
Applications • Adhesion to heat sinks of electronic devices (IGBTs, transformers, inverters, etc.) • Bonding of battery modules • Bonding to heat sinks of semiconductors
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Azumax sells specialty chemicals for functional materials, pharmaceuticals, and pesticides, as well as testing kits for food, feed, and environmental use.