Heat-dissipating silicone adhesive
Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation.
basic information
Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation. It adheres to the surfaces of organic resins, metals, and ceramics without generating by-products during the curing reaction. The thin layer of silicone formed enhances thermal conduction from the device to the heat sink.
Price range
Delivery Time
Model number/Brand name
PP2-TC01
Applications/Examples of results
Applications • Adhesion to heat sinks of electronic devices (IGBTs, transformers, inverters, etc.) • Bonding of battery modules • Bonding to heat sinks of semiconductors