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Heat-dissipating silicone adhesive

Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation.

Features and Benefits • Thermal conductivity • Soft, compressible • Self-adhesive • Non-flowable and thermosetting • No curing by-products • Addition curing with platinum catalyst

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basic information

Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation. It adheres to the surfaces of organic resins, metals, and ceramics without generating by-products during the curing reaction. The thin layer of silicone formed enhances thermal conduction from the device to the heat sink.

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Model number/Brand name

PP2-TC01

Applications/Examples of results

Applications • Adhesion to heat sinks of electronic devices (IGBTs, transformers, inverters, etc.) • Bonding of battery modules • Bonding to heat sinks of semiconductors

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