Study on the decomposition using hydrofluoric acid and nitric acid in the analysis of impurities in silicon.
Minimize exposure to hydrofluoric acid gas for people and improve the work environment! Also contributes to reducing work hours.
This technical document discusses the automatic pre-treatment using hydrofluoric acid and nitric acid for the silicon decomposition (melting) of semiconductor materials and other raw materials, utilizing the automatic pre-treatment device "DEENA" with acid addition and other processes controlled by a PC. When analyzing the silicon (metallic silicon, Si) content and impurities in semiconductor materials, hydrofluoric acid is often used. However, hydrofluoric acid is highly reactive with silicon, requiring careful addition in very small amounts, and during this process, a large amount of hydrofluoric gas is released, necessitating precautions against human exposure. Therefore, we examined the automatic pre-treatment using hydrofluoric acid and nitric acid for the silicon decomposition (melting) of semiconductor materials and other raw materials with DEENA, which can perform tasks such as acid addition, stirring, and measurement automatically under PC control. [Contents] ■ Purpose ■ Overview ■ Reagents Used ■ Analysis Flow, etc. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Basic Performance of the Device】 ＜DEENA60 Main Unit＞ ■ Automatic addition of reagents (up to 8 types of reagents can be installed) ■ Stirring by shaker ■ Heating by hot plate ■ Cooling ■ Automatic addition of internal standard solutions and standards ■ Meniscus adjustment using ultrasonic height sensor *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
