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A formulation of heat stabilizers and processing aids used in multiple polyolefin compositions for recycling applications【RECYCLOBYK 4370】.
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Adhesion promoter for TPS-S overmolded compounds, impact resistance enhancer for polyamide compounds [SCONA TSKD 9103].
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MAH-free dispersing agent for polyethylene coloring agents and anti-warping for composite materials【SCONA TSPE 3219 GAHD】.
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Carrier-free heat stabilization mixed granules based on inorganic salts used in polyamide compounds to enhance thermal stability【BYK-MAX HS 4304】.
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Thermal stabilization mixed granules based on inorganic salts used in polyamide compounds to enhance thermal stability [BYK-MAX HS 4306].
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Thermal stabilization mixed granules based on inorganic stabilizers used in polyamide compounds to enhance thermal stability【BYK-MAX HS 4308】.
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Coupling agent for filler and fiber-reinforced polypropylene composites, compatibilizer for mixtures of polypropylene and polar polymers <SCONA 20097
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Coupling agent for filler and fiber-reinforced polypropylene composites, compatibilizer for mixtures of polypropylene and polar polymers <SCONA 20070
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Coupling agent for filler and fiber-reinforced polypropylene composites, compatibilizer for mixtures of polypropylene and polar polymers <SCONA 20098
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Coupling agent for filler and fiber-reinforced polypropylene composites, compatibilizer for mixtures of polypropylene and polar polymers <SCONA 25097
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Processing additive for stabilizing thermoplastic compounds during downtime in HDPE and PP extruders <BYK-MAX STARTSTOP 4205
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Long-term heat stabilizer formulation suitable for polypropylene compounds [BYK-MAX HS 4314]
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Modifier based on a copolymer functionalized with maleic anhydride for polypropylene fillers【SCONA TPPP 2003 FB】.
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Coupling agent with high effectiveness for PP compounds containing short fiber glass and fillers【SCONA TPPP 9112 FA】.
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Coupling agent for polypropylene filler compounds and glass fiber compounds [SCONA TPPP 9112 GA]
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![Adhesion promoter for TPS-S overmolded compounds, impact resistance enhancer for polyamide compounds [SCONA TSKD 9103].](https://image.mono.ipros.com/public/catalog/image/2074951/IPROS12426009362453911734.jpeg?w=120&h=170)
![Thermal stabilization mixed granules based on inorganic salts used in polyamide compounds to enhance thermal stability [BYK-MAX HS 4306].](https://image.mono.ipros.com/public/catalog/image/2074951/IPROS374028874004062860.jpeg?w=120&h=170)
![Long-term heat stabilizer formulation suitable for polypropylene compounds [BYK-MAX HS 4314]](https://image.mono.ipros.com/public/catalog/image/2074951/IPROS5218976415003145079.jpeg?w=120&h=170)
![Coupling agent for polypropylene filler compounds and glass fiber compounds [SCONA TPPP 9112 GA]](https://image.mono.ipros.com/public/catalog/image/2074951/IPROS6313194122603825173.jpeg?w=120&h=170)