MiniLab-026-TE/LTE/SP The smallest model in the MiniLab series, a standalone thin film experimental device with a 19-inch single rack frame. It has a compact size requiring a minimum installation space of 600mm in width and 600mm in depth, allowing for TE (resistive heating evaporation), LTE (organic thin film evaporation), and SP (sputtering) experiments. Despite its small size, it features PID automatic loop film deposition control (manual operation is also possible) and can perform simultaneous deposition.

MiniLab-026-GB (Glove Box Storage Type) A glove box model with the MiniLab-026 chamber installed in the workbench and the control unit stored underneath the bench.

Standard diagram

MiniLab-026 Etch/Anneal Station A device equipped with an RF dry etching stage and a substrate heating stage in the MiniLab-026 chamber. There are two models: a standalone version housed in a MiniLab series 19-inch rack frame and a variant stored in a glove box, the MiniLab-026-GB. This product is a collaborative development with the University of Manchester's Graphene Group. It contributes to the development of TMDC and 2D materials through a unique RIE system that operates at under 30W, offering low damage and excellent control precision.

MiniLab-060-TE/LTE/EB/Sputtering Device The "MiniLab-060" series is an R&D device that can be configured for a wide range of purposes, including TE (resistive heating evaporation), LTE (low-temperature organic film deposition), EB evaporation, and RF/DC magnetron sputtering, by incorporating a rich variety of components in a modular fashion. There are also many options available, such as vertical lift, substrate rotation, heating and cooling stages, and load lock. (The photo shows the EB model equipped with a 6 pockets evaporation source.)

The MiniLab-060 PECVD device is a semi-automatic plasma CVD machine equipped with up to four gas lines, RF/DC power units, and a substrate heating and rotating stage (max 1200°C). It features a high vacuum specification with a 60L volume chamber, equipped with RP (DP) + TMP, allowing for stable automatic control of vacuum and gas pressure through PLC/MFC. It is capable of conducting film deposition experiments on wafer sizes ranging from 1 to 8 inches.

MiniLab-080-TE/LTE/SP Box-type chamber: A higher model than the MiniLab-060, which can add a load lock mechanism to an 80-liter large chamber with a chamber height of 570mm. The longer T/S distance adjustment range contributes to improved film uniformity.

MiniLab-090 (*Glove Box Storage Type) This is a glove box model of the Mini-Lab-080, which features a large 80L chamber with dimensions of 400x400x570, stored within a workbench. It has a front-loading design with sliding doors, a maintenance door accessible from the back of the chamber, and is a space-saving, high-spec model that maximizes the use of the workbench despite the large chamber size. It can be used for various purposes such as vacuum deposition, sputtering, and RF etching. It allows for clean thin film experiments without exposing samples to the atmosphere or moisture after processing.

MiniLab-125 All options of the MiniLab series can be equipped in a large high-capacity chamber (500x500x600mm). It is the top-end model of the MiniLab series, covering applications from research and development to small-scale production. It offers a wide range of options such as a load lock system, automatic mask changer, and planetary dome.