Semi-automatic conveyor-type parallel processing bonding device 'C-ASE320naa'
One-way conveyor type with a panoramic view! 50% cycle time improvement from our standard specifications through parallel processing.
The "C-ASE320naa" is a semi-automatic conveyor-type parallel processing bonding device with a mechanical chuck for the peeling machine. It is capable of automatic positioning alignment using a 5-megapixel CCD camera for image processing. The four processes of supply, peeling, alignment bonding, and discharge are carried out simultaneously. Please feel free to consult us when you need assistance. 【Features】 ■ 50% increase in takt time from our standard specifications through parallel processing ■ Automatic positioning alignment using a 5-megapixel CCD camera for image processing ■ Alignment accuracy of ±0.15mm *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications (Partial)】 ■Device Name: C-ASE320naa (One-view type, Conveyor one-way system) ■Device Size: W2300×D1700×H2100 (mm) ■Weight: Approximately 1.2t ■Work Specifications ・Upper Suction Cup: t0.05～3.0 (mm) *Glass up to 1kg in weight ・Lower Suction Cup: t0.05～1.0 (mm) ■Bonding Size: MaxW300×L200×t (Total) 3 (mm) ■Machine Cycle Time: Approximately 20 seconds/piece (with alignment) *Varies depending on conditions *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
