Semi-automatic conveyor-type parallel processing bonding device 'C-ASE430naa'
Positioning accuracy ±0.1mm! Automatic alignment using image processing with two 5-megapixel black and white cameras.
The "C-ASE430naa" is a semi-automatic conveyor-type parallel processing bonding device with a one-way conveyor and a panoramic view type. The peeling machine uses tape, with the upper suction cup made of AL electroless nickel plating and the lower suction cup designed for conveyor use. Please feel free to consult us when you need assistance. 【Features】 ■ Automatic positioning alignment using two 5-megapixel black and white cameras ■ Alignment accuracy of ±0.1mm (when alignment marks are present) ■ Panoramic view type, one-way conveyor *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications (Partial)】 ■Device Size: W3500×D3300×H2000(mm) ■Weight: Approximately 2.4t ■Work Specifications: Reference ・Upper Suction Cup: 300×400/t0.1～t3(mm) ・Lower Conveyor: 300×400/t0.1～t100(mm) ■Bonding Size: MaxW300×L400×t (Total) 15(mm) ■Machine Cycle Time: 20 seconds/piece *Varies depending on conditions (bonding only, fastest) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
