Panther Lake equipped with 3.5-inch + SBC

Intel Core Ultra Series 3 equipped with 3.5” Plus SBC – 3I160DW

The 3.5" Plus (146 × 150mm) size SBC equipped with the Intel Core Ultra Series 3 (Panther Lake) features enhanced graphics performance with a powerful iGPU and a dedicated NPU to accelerate edge AI processing. Designed for high-performance computing, the 3I160DW supports up to 64GB of DDR5 memory through two SO-DIMM slots. It offers a variety of display outputs including dual HDMI, LVDS/eDP, and USB Type-C (DP Alt Mode). Additionally, it is equipped with Intel 2.5G LAN ×2, four serial ports, and three MIPI-CSI interfaces, making it suitable for advanced imaging applications. The expansion options are also very flexible, featuring PCIe x2/x4, a Nano SIM slot, and multiple M.2 interfaces (for storage, wireless, and 5G support). With a wide DC input range and robust design, the 3I160DW is an ideal solution for use in harsh environments such as industrial automation, smart factories, transportation, and healthcare.

basic information

Main features: - Intel Core Ultra 300 series (Panther Lake) processor - Enhanced iGPU and integrated NPU - DDR5 SO-DIMM ×2, up to 64GB - Multi-independent display support: HDMI ×2, LVDS/eDP, USB Type-C (DP Alt Mode) - Network I/O: Intel 2.5GbE LAN ×5, USB 3.2 Gen1 ×3, USB 2.0 ×5 - Expansion slots: M.2 M Key ×1, M.2 B Key ×2, Nano SIM ×1, PCIe x2 ×1, PCIe x4 ×2 - Other interfaces: COM ports ×4, digital I/O (4DI/4DO), MIPI-CSI ×3, HD Audio - Security and control: TPM 2.0, SMBus, I2C, I2S

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Model number/Brand name

3I160DW

Applications/Examples of results

Industrial automation, smart factory, transportation sector, healthcare

Detailed information

3I160DW Equipped BOX PC - HAWK-3I160DW

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3I160DW Datasheet

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We will be exhibiting at EdgeTech+ West 2026 from July 23 (Thursday) to July 24 (Friday).
- UPDATE
- Seminar・Event
We will be exhibiting at "EdgeTech+ West 2026," which will be held at Grand Front Osaka from July 23 (Thursday) to July 24 (Friday), 2026. We will showcase our latest solutions and services, including demonstrations. This time, we will display SBCs and BOX PCs equipped with the latest Intel processor Panther Lake, a new type of enclosure capable of housing GPUs, SBCs with ARM architecture processors from Geniatech, and AI accelerators. Additionally, we will exhibit various modules compliant with the OSM (Open Standard Module) standard established by SGET, as well as carrier boards for evaluation and development. When you visit, please be sure to stop by our joint exhibition booth (B-G12). ■Overview of EdgeTech+ West 2026 Dates: February 23 (Thursday) 10:00 AM to July 24 (Friday) 5:00 PM, 2026 Venue: Grand Front Osaka, North Building, B2F Congre Convention Center Participation Fee: Free (Pre-registration required via the website)

Jul 01, 2026

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Connect Co., Ltd.

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Our company is a specialized trading company that deals with various embedded products such as edge AI, industrial computers, single-board computers (SBCs), and image capture boards. We handle embedded systems equipped with the latest Intel CPUs (such as Intel Elkhart Lake Atom, Tiger Lake, and Raptor Lake), which are essential for building FA, IoT, and AI edge systems.

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