Exhibition Participation Announcement: "InterNepcon Japan 2018"

コヒレント・ジャパン 本社、大阪支店、厚木TEC
Coherent Japan, Inc. will be exhibiting at "InterNepcon Japan 2018," which will be held from January 17, 2018 (Wednesday). Please come and see our scaled-up laser processing solutions after the Coherent/Rofin integration. 【Highlights of the Exhibition】 ◆ Welding, bonding, cutting, etc. Thermal processing laser solutions Introduction of the benefits of welding processing with variable beam modes Live demonstration of manual laser welding; we welcome sample processing! Please bring your desired processing samples! Testing demonstrations can be conducted at the venue. ◆ Short pulse laser solutions for fine processing (femtosecond/picosecond/nanosecond) From high-power lasers for thermal processing to short pulse lasers for fine processing, we will propose the optimal laser processing solutions from our rich product lineup. 【Exhibition Details】 Name: InterNepcon Japan 2018 Dates: January 17 (Wednesday) to 19 (Friday), 2018 10:00 AM to 6:00 PM (until 5:00 PM on the last day) Venue: Tokyo Big Sight, East Hall Booth No.: East Hall 2 E10-15 We sincerely look forward to your visit.

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Date and time Wednesday, Jan 17, 2018 ~ Friday, Jan 19, 2018
10:00 AM ~ 06:00 PM
(Ends at 5 PM only on the final day) - Capital Tokyo Big Sight
- Entry fee Free At the time of entry, an invitation ticket and two business cards will be required.