Insulating thermal gap filler for electronic components / YG, YGF series
Low molecular weight siloxane-free soft TIM material
This is an insulating thermal grease/gap filler that uses in-house manufactured materials such as urethane resin and composite oxide-based thermal fillers. Tailored for low thermal resistance, it employs resin synthesis and dispersion processing technologies developed over many years, resulting in a thermally conductive resin paste that combines low hardness and high adhesion, taking advantage of urethane properties. Since it does not contain low molecular siloxane, there are no concerns about contact failures due to outgassing inside electronic components. Additionally, the thermal filler uses our own soft-type filler, which reduces wear inside the dispenser and contributes to lower running costs of the equipment. By in-house manufacturing the resin and filler, we have also achieved a reduction in the overall product cost.
basic information
1) 1-component non-curing/adhesive/paste form 2) 2-component room temperature curing/adhesive/paste form C series 1 / 1.8W design - low cost - lightweight - flexibility C series 2 / 2.5W design - low cost - lightweight - flexibility 0 series / 3.2W design - reduced mechanical friction M series / 4.6W design - medium to high thermal conductivity
Price information
Negotiable
Delivery Time
Model number/Brand name
Seika Seven YG/YGF
Applications/Examples of results
※Applicable Uses - LiB - Power Electronics - LED - Peltier Module, etc...
Line up（3）
| Model number | overview |
|---|---|
| YGF-C001 | This is a two-component room temperature curing type, 1.8W thermal conductive resin paste, low cost, and low specific gravity. |
| YGF-C002 | This is a two-component room temperature curing type, 2.5W thermal conductive resin paste, low cost, and low specific gravity. |
| YGF-001 | This is a two-component room temperature curing type, 3.2W thermal conductive resin paste, designed to reduce mechanical friction. |
