Manual Wafer Mounting Machine
The compatible sizes are φ4 to 8"! We support the thinning process of various device wafers from prototyping to mass production.
We would like to introduce our "Manual Wafer Mounter." This device attaches wafers coated with WAX to a support substrate within a vacuum cup. By performing the attachment of the wafer and support substrate inside the vacuum cup, it avoids the inclusion of air bubbles. After attachment, the "Air Stamp" process is performed to correct TTV. 【Features】 ■ Attaches wafers coated with WAX to a support substrate within a vacuum cup ■ Avoids the inclusion of air bubbles by performing the attachment inside the vacuum cup ■ Corrects TTV by performing the "Air Stamp" process after attachment ■ Supports the thinning process of various device wafers from prototyping to mass production *For more details, please refer to the related links or feel free to contact us.
basic information
【Specifications】 ■Model: DMT-150 ■Version: Type1 ■Compatible Sizes: φ4–8″ ■Components ・Inversion: Vacuum attachment section ・Heating: Stamping section *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
