High-performance automatic appearance (6-sided chip) inspection device

Free hardware selection! Cameras, lenses, PCs, and other equipment available on the market can be used freely.

The "High-Function Automatic Appearance (6-Surface) Inspection Device" allows for easy and highly precise appearance inspections such as dimension measurement and defect inspection of semiconductor chips. Thanks to Z-axis image synthesis processing, even when using high-magnification lenses, deep images can be obtained quickly, and planar correction can be performed on inclined workpieces. Cameras, lenses, PCs, and other market devices can be freely used, and real-time observation with line cameras is also possible. Customization according to customer specifications is available. 【Features】 ■ High-speed long depth measurement (multi-focus imaging) ■ High-precision measurement ■ Freely configurable image processing flow ■ High-speed 6-surface inspection measurement ■ Damage-free handling mechanism *For more details, please refer to the related links or feel free to contact us.

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【Standard Device Specifications (Partial)】 ■ Measurement Stage: 6-sided stage specification (front face, right side/top face, rear face, left side) with bottom face measured during transport ■ Auto Focus: Z-axis (set resolution 0.1μm) high-speed auto focus function (200msec/20 images) * Varies depending on exposure time ■ Objective Lens: 20X (freely selectable) ■ Inspection Resolution: Capable of detecting scratches of 1μm, contamination inspection with a resolution of 0.25μm (at 20X) ■ Illumination: Coaxial oblique illumination (3-color high-brightness LED), ring illumination (3-color LED lighting: low angle) ■ Vibration Isolation Table: Active pneumatic vibration isolation table ■ Control: PC (Windows-based) * For more details, please refer to the related links or feel free to contact us.