Non-cyanide substitution type electroless silver plating solution Dine Silver EL-3S
Non-cyanide substitution type electroless silver plating solution
Traditionally, cyanide complex-based plating solutions have been used for replacement-type electroless plating of silver (Ag), but there have been many issues regarding the working environment and wastewater treatment costs. The Dain Silver EL-3S process is a replacement-type electroless Ag plating solution that contains no cyanide at all and has performance equivalent to that of cyanide baths. It also has a long liquid life and can be applied not only to copper materials but also to electroless Ni-P plated materials. It can be used as an alternative plating for electroless Ni-P/electroless Au plating, which is a coating for soldering printed circuit boards, and by directly plating Ag onto copper circuits using the EL-3S process, it can reduce plating costs. Furthermore, it demonstrates superior reliability in solderability compared to heat-resistant preflux.
basic information
**Features** - Contains no cyanide compounds and is non-toxic. - Wastewater treatment is easier, reducing costs and achieving a safe working environment. - No external power supply is needed; simply immersing in the plating solution forms an Ag plating film. - Excellent liquid stability, resulting in a longer liquid life. It can be reused repeatedly by replenishing the reduced Ag ions. - The physical properties, such as solderability and adhesion of the plating film, are good. - Ideal for surface treatment of printed circuit boards, achieving cost reductions compared to electroless Ni-P/electroless Au plating. It also offers better solderability reliability than heat-resistant preflux, especially after high-temperature thermal history in lead-free soldering. - Being acidic, it does not have corrosive effects on resist films. - Post-treatment with the silver discoloration preventive Nu-Dyne Silver significantly prevents discoloration caused by sulfur gas and sulfide solutions, which are characteristic of silver plating. For other functions and details, please contact us.
Price information
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Applications/Examples of results
【Applications】 〇 Solderability coating for printed circuit boards (alternative to electroless Ni-P/electroless Au plating and heat-resistant preflux) 〇 Ag plating on materials coated with resist film that is eroded by alkali ● For other functions and details, please contact us.
