Silver Tarnish Prevention - New Dain Silver
Silver tarnish inhibitor
Silver, silver alloys, or silver-plated products are widely used in tableware and jewelry due to their beautiful silver color. Furthermore, they possess excellent electrical properties such as solderability and contact electrical resistance, making them useful as contact materials in electronic components. However, silver generally tarnishes easily, particularly through sulfide formation, changing to yellow, purple, and in severe cases, black. The tarnishing of silver not only detracts from its aesthetic appeal and reduces its commercial value but also adversely affects solderability and contact electrical resistance. New Dain Silver prevents silver tarnishing for an extended period with a very simple room temperature, short-duration immersion treatment. The protective film formed by the New Dain Silver treatment is an extremely thin organic chelate film. The treatment does not alter the appearance of silver or degrade its solderability or contact electrical resistance.
basic information
**Features** - It not only suppresses the discoloration of silver over a long period but also prevents the deterioration of solderability and contact electrical resistance. - Even after undergoing harsh hydrogen sulfide gas testing (JEIDA-40-1984), there is no discoloration or deterioration of electrical properties. (For ammonium sulfide solution immersion tests, New Dain Silver S-1 is suitable.) - The discoloration prevention process involves a simple room temperature, short-duration immersion treatment that does not cause stains or color changes on the plating surface. - Management of the treatment solution can be done through simple analysis using refractive index or spectrophotometry. - The main component is an aliphatic organic compound, which is a low-toxicity treatment agent that does not contain heavy metals like chromium or carcinogenic substances. For other functions and details, please contact us.
Price information
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Delivery Time
Applications/Examples of results
【Purpose】 〇 Removal of palladium smut from various printed circuit boards. Particularly effective for fine pattern boards. ● For other functions and details, please contact us.
