High melting point solder plating material "DAIN TINGOOD 802"
Plating is possible with relatively high current efficiency! A stable Sb content (approximately 10 wt%) coating can be obtained.
"DAIN TINGOOD 802" is a Pb-free high melting point solder plating material. It is an acidic bath (organic sulfonic acid) that does not contain fluorides, allowing for a stable Sb content (approximately 10 wt%) coating to be obtained. Plating can be performed with relatively high current efficiency. 【Usage Conditions】 ■DAIN TINGOOD 802BASE ・Concentration Condition: 900mL/L ■DAIN TINGOOD Sb-36 ・Concentration Condition: 11.5g/L ■DAIN TINGOOD S-25 ・Concentration Condition: 80g/L *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Current density (A/dm2): 4 (1–6) ■Bath temperature (°C): 45 (30–55) ■Stirring: Appropriate bath stirring, cathode oscillation ■Anode: Insoluble ■Electrode ratio: As appropriate ■Filtration: Continuous filtration recommended *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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"Things that no one has done yet" and "There are surely people who will be happy if it exists"… The Yamato Kasei Group develops its unique chemical business in niche markets that major manufacturers do not tackle, under the spirit of 'San-so.' The value of the Yamato Kasei Group lies in launching new products into the world through original technology development that does not imitate others. With this sentiment in mind, we adopted "We are Chemical Innovators" as our corporate slogan. To put this slogan into practice, we will continuously challenge ourselves with new, interesting, and unprecedented endeavors.