Lead-free low melting point solder plating
Low-temperature mounting is possible for weak heat-resistant materials such as PET.
By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - The Bi content (20-60 wt%) can be controlled by changing the usage conditions. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】Dainting Alloy I - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.
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