Non-cyanide electroless silver plating
Silver plating can be formed by immersion without the need for an external power source.
◆Replacement Type (Dine Silver EL Process) - A silver plating film with good adhesion can be deposited on Cu and electroless Ni-P. - The bath life is long at 3 turns, with good stability over time. - It is an acidic plating process that can accommodate surface treatment of registry substrates. - Thick films of 0.5μm or more can be achieved. ◆Reduction Type (Dine Silver RD Process) - Can be deposited on non-conductive materials (resin, glass, etc.) with a catalyst applied. - A silver plating film of approximately 0.5μm can be formed in 1 hour. - Usable at temperatures below 60°C.
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