Lead-free low melting point solder plating
Low-temperature mounting on weak heat-resistant materials such as PET is possible.
By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. Plating allows for implementation on patterns and small components. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - By changing the usage conditions, the Bi content (20-60 wt%) can be controlled. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】DAINTINGOOD 511 - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.
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