Interconnection Conductive Adhesive Silver Epoxy
Adhesives for interconnection of various sizes and types of die attach and modules.
We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html
basic information
NIC BOND NB7000 Series
Price information
Sample 0 yen. Free Sample Please feel free to contact us.
Delivery Time
Model number/Brand name
NIC BOND NB7000 Series
Applications/Examples of results
X-ray scintillator IC card Semiconductor die bonding
