"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7
This is a new type of adhesive that combines ultra-flexibility and stretchability with the reliability of epoxy resin.
This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html
basic information
⭐️ It's epoxy resin, yet super flexible. Look! Special Flexible Epoxy. ⭐️ It's epoxy resin, yet stretches super (200%). Look! Special Extend Epoxy. (200%) ⭐️ Cures at room temperature in seconds, can be reflow cured. RT Cure ~ Rapid Cure. Reflow Cure. ⭐️ Reflow resistant. ⭐️ Usable from ultra-low to high temperatures -45℃ to 80℃. Operating Temp.
Price information
Sample 0 yen. Please feel free to contact us.
Delivery Time
Model number/Brand name
NIC BOND NB9000 Series NB9000 Series
Applications/Examples of results
Waterproof and dustproof seals for electronic devices, waterproof and dustproof seals for electronic components (switches, connectors, buttons, etc.).
