"Conductive Grade" Silver Epoxy
Ideal for semiconductor die attach and interconnection between modules and substrates.
basic information
⚫︎ For semiconductor die attach (conductive) ... NIC BOND NB NB7000 NB7400 NB7401 NB7100 NB7500 NB7600 (PIN Transfer/RAPID CURE) NB8000 (high heat resistance) also offers insulating adhesives. ⚫︎ For IC Card Module ... NIC BOND NB700-5, NB7000 ⚫︎ Ultra flexible, large area, compatible with a wide range of environmental specifications Premium Flex, Any Range Temp. ... NIC BOND NB9100Ag-6 * We also offer products for printing, stamping, and dispensing.
Price information
Sample 0 yen. Sample Free Please feel free to contact us.
Delivery Time
Model number/Brand name
NIC BOND NB7000,8000 Series
Applications/Examples of results
- Large to small IC chip - Conductive connection of modules - Conductive connection between substrates - IC card assembly - Bump/pad formation
