"Insulating" grade NIC BOND NB4000 Series
It is suitable for adhesion to areas requiring insulation. Non Conductive Type
NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html
basic information
NIC BOND Insulation Grade Non Conductive Grade ⚫︎NIC BOND NB4000 Non Conductive Die Attach Two component Epoxy Adhesive Vis.(Mixed) 6,500cps Curing Schedule 150℃ 5min Tg >88 ℃ ⚫︎NIC BOND NB4100 Non Conductive Die Attach / Low Vis. Type Two component Epoxy Adhesive Vis.(Mixed) 1,100cps Curing Schedule 150℃ 5min Tg >88 ℃ ⚫︎NIC BOND NB4400 Non Conductive Die Attach Fast Cure Two component Epoxy Adhesive Vis.(Mixed) 53,000cps Curing Schedule 150℃ 5min Tg >95 ℃
Price information
Sample 0 yen. Please feel free to contact us.
Delivery Time
Model number/Brand name
NIC BOND Insulation Grade Non-Conductive Epoxy
Applications/Examples of results
Semiconductor die attach, substrate bonding, thermal adhesive
