Solvent-free low linear expansion adhesive NICBOND NB3004
Solvent-free low expansion adhesive
This product is an adhesive that suppresses the coefficient of linear expansion to a level comparable to that of metals. The resulting cured material exhibits high adhesion and heat resistance. Despite being solvent-free, it achieves both a low coefficient of linear expansion and low viscosity. Since its coefficient of linear expansion is similar to that of metals, the risk of delamination issues is significantly reduced.
basic information
Minimum curing conditions: 80℃ for 30 minutes, 90℃ for 15 minutes, 100℃ for 10 minutes, 150℃ for 5 minutes Heat resistance temperature: 107℃
Price range
Delivery Time
Model number/Brand name
NICBOND NB3004
Applications/Examples of results
Applications that require the reliability of electronic components, etc.
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The Nichimori Business Division produces industrial and automotive lubricants that support the movement and safety of mechanisms in various aspects of daily life. Lubricants that utilize the properties of molybdenum disulfide, as well as special lubricants that do not use oil, are used in a wide range of applications including electronic devices, automobiles, and large machinery, ensuring smooth operation and safety of mechanisms. We are also developing new lubricants that consider the impact on the environment and human health. Furthermore, we are engaged in the development of a wide range of products, including various chemical products and a spray cap that safely and easily removes residual gas, which has become a problem with the disposal of spray cans. Additionally, we aim to expand our business in various fields, including the supply of metallic molybdenum, molybdenum compounds, and adhesives for the electronics industry, as well as the sale of "wine," which can also be considered a lubricant for humans. We provide special lubricants and high-performance adhesives.