Inolas Solutions Flexible Substrate Laser Processing Equipment
Inolas Solutions' laser processing equipment cuts rigid substrates, flexible substrates, and composite substrates quickly and cleanly.
Inolas Solutions' laser processing equipment cuts rigid substrates, flexible substrates, and composite substrates quickly and cleanly. It is also an optimal solution for drilling holes in substrates, contour processing, and splitting component mounting substrates. **Benefits of Laser Processing Equipment for PCB and Flexible Substrates:** - Compared to NC processing, the precision and cleanliness of the cutting surface are very high. - It does not impose thermal or vibrational stress on the substrates. - It allows for depaneling with a small laser spot diameter, enabling more substrate layouts on a single panel. - It can accurately and quickly split substrates with curved shapes. - The manufacturer's unique laser technology helps reduce the burden of capital investment in laser processing equipment.
basic information
About InnoLas Solutions GmbH - The company was established in 1995 as a manufacturer specializing in laser micro-processing equipment in Krailling, near Munich, Germany. - Through collaboration with various laser source manufacturers and proprietary development technologies, the company has delivered over 2,000 units worldwide. - The company has a demo room with mass production machines, where it conducts sample testing for customers and application development.
Price range
Delivery Time
Applications/Examples of results
Laser processing of rigid substrates, flexible substrates, and composite substrates.
