Solve material loss of metal powder with in-house manufacturing! 'Centrifugal Powder Manufacturing Device'
Attention those struggling with material loss! In-house production of spherical metal powder increases product yield by approximately 40%! [Solder, aluminum, zinc, tin, iron alloys, copper, etc.]
The "Metal Powder Manufacturing Device" utilizes centrifugal force to produce spherical powders with particle diameters ranging from 5 to 350 μm. Compared to conventional gas atomization and water atomization methods, it can increase the product yield by approximately 40%. If you are struggling with costs associated with purchasing metal powders or material loss, please take this opportunity to check out our catalog. 【Features】 - Good particle size distribution, reducing material loss - Compatible with high melting point, low melting point, and fine powders - Controls melting temperature and disk rotation speed to produce uniform spherical particles *Contract manufacturing is also available. Please feel free to consult us. 【For those facing these issues】 - Do not want to waste expensive materials - Want to reduce material loss - Want to minimize costs, etc. ★ We are currently offering a technical brochure on the "Centrifugal Powder Manufacturing Device" ★ If you are facing the above issues, please take this opportunity to download and take a look!
basic information
【Target Metals】 ■Solder ■Aluminum ■Zinc ■Tin ■Iron Alloys ■Copper, etc. 【Main Applications】 Solder powder (melting point: approximately 180°C) is used as solder paste for printing on printed circuit boards and for soldering fine components. Additionally, it is also ideal for manufacturing materials for metal 3D printers. Recently, there has been an increasing demand for fine powders of high melting point metals. *Contract manufacturing is also available. Please feel free to consult with us. *For more details, please download the catalog or contact us.
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Applications/Examples of results
Hafnium powder (melting point: approximately 180°C) is used as solder paste for printing on printed circuit boards and for soldering fine components. Recently, there has been an increasing demand for high melting point metals in fine powder form.
