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HFIX-1

Next-generation edge AI pioneer: Intel Core Ultra Series 3 equipped CPU board 'HFIX-1'

- Equipped with the latest Intel Core Ultra series 3, achieving high performance and low power consumption ideal for edge AI. - Features Xe3 GPU and Intel AI Boost NPU, significantly enhancing edge AI performance. - Ensures environmental durability required for industrial applications with a wide operating temperature range and onboard memory. - Ensures high connection reliability with PCI Express expansion using floating connectors. - Compact yet equipped with a rich array of interfaces. - Compatible with Windows 11 IoT Enterprise LTSC 2024.

Related Link - https://www.dux.jp/product/cpu/hfix1

basic information

■CPU: Intel Core Ultra Series 3 processors ■Memory: Onboard LPDDR5x-7467/6800, up to 32GB, In-Band ECC support ■Storage: M.2 NVMe SSD, PCI Express 3.0 compliant (max 8GT/s), 2280 Type M-Key connector ■USB: 2 ports USB 3.2 compliant (up to 5Gbps), 4 ports USB 2.0 compliant (up to 480Mbps) ■PCI Express 3.0 compliant (max 8GT/s) x2 Lane 1 Slot or x1 Lane 2 Slot PCI Express 3.0 compliant (max 8GT/s) x4 Lane 1 Slot ■LAN: 4 ports 2500BASE-T/1000Base-T / 100Base-TX / 10Base-TE (Wake On LAN supported) ■Video: 2 ports DisplayPort dual-mode, EXTGFX expansion connector ■Operating ambient temperature: 0~50℃ *Can support -15~50℃ depending on CPU ■Dimensions: 170(W) × 170(D) mm

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