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Compound semiconductor wafer polishing device, tape-type polishing device for small wafers.

syo.jpg

Compound semiconductor wafer polishing device, tape-type polishing device for small wafers.

syo.jpg
syo.jpg

[Made in Japan] Precision Grinding Tape Used

This is a space-saving, low-cost tape-type precision grinding device specialized for bevel grinding and oil-free grinding.

Related Link - http://e-imt.co.jp/?p=63

basic information

【Features】 ● Achieves stable surface roughness with a consistently fresh abrasive surface ● Compatible with outer circumference and orifice ● Ideal for forming compound semiconductor end faces *For more details, please contact us.

Price information

Please feel free to contact us.

Delivery Time

Please contact us for details

Please feel free to contact us.

Model number/Brand name

SYO-125

Applications/Examples of results

Polishing of compounds and semiconductor wafers - Compatible with silicon carbide, silicon wafers, sapphire, glass, etc.

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