Silicon Wafer Edge Polisher [Made in Japan]
This is a new silicon wafer edge polishing device developed with the concept of space-saving and high throughput.
● High throughput polishing is possible without selecting wafers ● Improved processing surface accuracy ● Chemical-free polishing is possible ● Removal of various films is possible ● Can be introduced into each process of wafer manufacturing
basic information
In the wafer manufacturing process, the silicon wafer edge polisher that enables improved throughput and surface accuracy has been globally adopted. The silicon wafer edge polishers compatible with 6-inch, 8-inch, and 12-inch wafers use precision polishing tape, and thanks to our patented technology, they can always polish with a new abrasive surface, ensuring stable polishing power.
Price information
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Delivery Time
Model number/Brand name
TUNeDGE
Applications/Examples of results
Silicon wafer edge polishers can be utilized for various applications. They are used in each manufacturing process of silicon wafers (after beveling, after etching, and for CVD film removal). They are also effective for reclaim applications and the removal of various metal films.