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Sputtering and Plasma Process Technology Committee 159th Regular Research Meeting Theme: "Cutting Edge of Atmospheric Pressure Plasma"

イー・スクエア

This is an announcement for the 159th regular research meeting of the Spattering and Plasma Process Technology Committee, to be held at the Kyoto University Katsura Campus. It was originally scheduled for September 4, but due to the approach of Typhoon No. 21, it has been decided to postpone this event. Information regarding future meetings will be provided on our website as it becomes available. [Overview of the Presentation] Surface treatment using atmospheric pressure plasma has the advantage of being low-cost and capable of continuous processing, as it does not require vacuum equipment. Additionally, recent developments in low-temperature plasma sources with gas temperatures close to room temperature have expanded applications into the bio and medical fields. We have arranged an opportunity to hear presentations on atmospheric pressure plasma, which has such high potential, covering topics from the basics to recent developments. [Excerpt from the Presentation Program] - Development of a new atmospheric pressure plasma device and its applications in medicine (Tokyo Institute of Technology) - Plasma surface modification technology for strongly bonding fluororesins and dissimilar materials (Osaka University) - Interaction between atmospheric pressure plasma and surfaces (Nagoya University) - Advantages of atmospheric pressure plasma surface modification and its equipment (E-Square) We sincerely look forward to your participation.